How the Copper Clad Laminates Production Line works?
CCL laminators combine copper foil with resin substrates (such as FR4) through high temperature and high pressure to form CCL. First, the copper foil and resin substrate are stacked together and put into the laminator. Then, the resin is softened by heating to the specified temperature through the heating system, and the resin is tightly combined with the copper foil by pressurization to remove air gaps. The heating and pressurization process solidifies the resin to form a strong composite layer. Finally, the lamination process is completed by cooling and curing to obtain a strong CCL.
Why the requirements of CCL press plate are higher than HPL: CCL is mainly used for printed circuit boards (PCB) and has extremely high requirements for electrical performance, strong adhesion of copper foil to substrate, and uniform curing of thermosetting resin. In contrast, fireproof board is mainly used for physical properties such as fire resistance and high temperature resistance, and the requirements for process control accuracy are relatively low. Therefore, the board standards required for CCL are naturally higher than those for fireproof board.
Consequences of not cleaning CCL press plate for a long time:
• Surface contamination: Over time, dust and grease will accumulate on the surface of the press plate, resulting in a decrease in the adhesion of the copper layer, which ultimately affects product quality.
• Corrosion on the copper surface:
Long-term exposure to air, moisture, and other environmental factors will cause the press plate to oxidize. If it is in a humid environment, it is more likely to corrode, resulting in reduced conductivity and potential circuit failure.
• Long-term contamination is difficult to remove:
Dirt that has not been cleaned for a long time becomes difficult to clean and may damage the surface of the press plate, causing damage to the press plate and product, reducing production efficiency, and may require replacement of a new press plate.
• Impaired product application performance:
Contaminants remaining on the product will interfere with signal transmission, affect heat dissipation and thermal conductivity, and ultimately affect the service life and performance of the product.
Our CCL press plate washing dryer machine uses a variety of methods, such as physical, chemical, or ultrasonic, to remove surface contaminants to ensure that the clean surface provides better adhesion and electrical performance for subsequent processes, ensuring long-term stability and reliability. The equipment is easy to operate and has high cleaning quality without leaving scratches on the press plate or causing deformation.
